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January 02, 2026
Breaking! TI lays off its MCU team in China!
Texas Instruments (TI) has laid off its MCU team in China (marketing and applications were retained, while R&D was abandoned) and moved its entire MCU product line to India.   It is said that all team members have been reassigned to other product lines, nominally with their positions and salaries remaining unchanged.   The company gave employees two choices: accept the reassignment to other product lines or voluntarily resign. This move is rather cunning, indicating that the company had no intention of going through a layoff process and would not offer any compensation to employees who voluntarily resign.   Reports indicate that TI's MCU R&D team in China mainly focused on the MSP430 product line, a series of 16-bit ultra-low-power, low-cost MCUs that TI launched to the market in 1996. Now, some team members have been laid off, while others have been merged into the LED DRIVER chip team. The domestic MCU industry is now engaged in a fierce "talent war." Fang Jing, chief electronics analyst at Minsheng Securities, stated that TI's MCU team was once one of the best-performing localized product lines, based in the Chinese market, specializing in localized customized development, and with very fast customer response. However, starting in early 2018, TI's MCU business began to decline, with the market gradually being taken over by emerging domestic MCU manufacturers, squeezing its survival space. "This team was mainly based in Shanghai, and the pandemic made operations even more difficult, so they simply withdrew," he said. He believes that although some employees could choose to transfer to other teams, the transition from digital to analog is significant, so "it was more of a stopgap measure for TI, as they didn't want to pay severance." He added, "The rise of domestic MCUs is accelerating, putting pressure on overseas leaders. This comprehensive layoff will likely further promote the substitution of domestic MCUs." Data shows that in 2020, Texas Instruments' general-purpose MCU market share was around 7%, far less than the top five companies such as Renesas Electronics, NXP, Infineon, STMicroelectronics, and Microchip Technology, while domestic MCU manufacturers have made rapid progress in this field in recent years.   Fang Jing, chief electronics analyst at Minsheng Securities, stated that TI's MCU team used to be one of the best-performing localized product lines, based in the Chinese market, specializing in localized customized development, and responding very quickly to customers. However, starting in early 2018, its business began to decline, with the market gradually being taken over by emerging domestic MCU manufacturers, squeezing its survival space. Furthermore, this team is primarily based in Shanghai, making operations even more difficult during the pandemic.   He believes that this complete layoff will further promote the substitution of domestically produced MCUs, and TI's withdrawal is just a trend; he expects more similar events to follow.
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  • December 23, 2025
    A Japanese company selling cloth got stuck with an AI chip
    Nittobo, a Japanese company that originated in the textile industry, has ventured into the research and development of T-Glass, a key material for AI chip packaging. This material is crucial for the stable operation of high-end chips. Nittobo monopolizes 90% of the global high-end fiberglass cloth market, with no competitors in the T-Glass field. With the explosive growth in AI demand, the material is in short supply, creating a supply gap. This "cloth-selling company" has thus secured a crucial link in the global AI chip industry. Today, let's learn about Nittobo:   I. A Century of Transformation: From Textile Mill to AI Material Giant Nittobo's history can be traced back to a textile company founded in 1898. Officially established in 1923, it is one of Japan's oldest silk textile companies. In its early years, it relied on surplus electricity from irrigation canals built by the Meiji government, generating electricity while simultaneously producing textiles, focusing solely on textile-related products until 1963. 1969 was a crucial turning point. With the rise of computer and chip technology, the company targeted market demand and ventured into the field of glass cloth for printed circuit boards. After decades of dedicated development, Nittobo has transformed from a traditional textile factory into a leading supplier of core AI materials, achieving a remarkable industrial upgrade.   II. Flagship Product T-Glass: The "Stable Cornerstone" of AI Chips Nittobo's core competitiveness stems from its T-Glass material, launched in 1984. Simply put, T-Glass is a high-performance glass fiber cloth, characterized by its high strength and minimal expansion under heat. Initially used in composite materials, it was later found to be particularly suitable for the electronics field—AI servers and high-end smartphone chip packaging substrates all rely on it. Chips generate heat during operation, and ordinary materials are prone to deformation and warping, while T-Glass effectively solves this problem, ensuring high-speed computing and long-term stable operation of chips, making it a key material for high-end chip packaging.   III. Market Monopoly: The "Hidden Hegemon" of High-End Global Glass Fiber Cloth In the high-end glass fiber cloth sector, Nittobo holds a near-monopoly. With only a handful of manufacturers worldwide capable of producing high-end NE glass fiber yarn, Nittobo alone controls 90% of the global high-end glass fiber cloth market share. Especially T-Glass, specifically designed for high-end ABF substrates, is unmatched by Nittobauer in this field. With the explosive growth in demand for AI servers, T-Glass is in short supply, even causing a shortage in BT substrates used in mobile phone chips. Goldman Sachs predicts a double-digit percentage shortage of T-Glass for BT substrates in the coming quarters.   IV. Industry Impact: The "Pricing Power Controller" Behind the Price Hike As an industry leader, Nittobauer's moves directly impact the global supply chain. In June 2025, Nittobauer announced a 20% price increase for glass fiber starting in August, triggering a chain reaction across the industry. This is driven by the explosive growth in AI demand—a single AI server requires 5-8 times more high-end glass fiber cloth than a regular server, while overseas manufacturers like Nittobauer have adopted a conservative approach to capacity expansion, leading to supply shortages. Currently, global demand for low-dielectric electronic cloth continues to rise, and Nittobauer's production capacity and pricing strategy directly affect the costs and supply cycles of downstream industries such as PCB and chip packaging.
  • December 21, 2025
    The world's first 2nm chip: officially released
    Samsung Exynos 2600 Heavy Release: 2nm 1、 On Friday, Samsung Electronics dropped a bombshell in the mobile semiconductor industry and officially announced the complete details of the industry's first 2-nanometer process smartphone application processor, Exynos 2600. This chip, which carries Samsung's top semiconductor strength, not only marks the official entry of mobile chips into the 2nm new era, but also relies on the surround gate (GAA) architecture as the cornerstone, in terms of performance AI、 Disruptive breakthroughs have been achieved in the four dimensions of imaging and heat dissipation, redefining the technological ceiling of flagship mobile computing cores. As the "super brain" of smartphones, the Exynos 2600 is built by Samsung's LSI department, with precision manufacturing of the GAA architecture guaranteed by the OEM factory, which will directly empower the Galaxy S26 series flagship models to be released early next year. The 10 core CPU configuration based on the latest Arm architecture is luxurious: led by one 3.8GHz Cortex-C1 Ultra super core, paired with three 3.25GHz Cortex-C1 Pro performance cores and six 2.75GHz Cortex-C1 Pro energy efficiency cores, forming a golden combination of "ultra-high performance+balanced energy efficiency", with overall computing performance skyrocketing by 39% compared to the previous generation. Significant improvement in AI and graphics performance: the integration of a 32K MAC NPU AI engine doubles the performance of generative AI workloads; With the support of Samsung Xclipse 960 GPU, the graphics performance has skyrocketed by 100% compared to Exynos 2500. Coupled with Kinetic Reality technology, ray tracing performance has been improved by 50%. Exynos Neural Super Sampling frame generation technology enables game smoothness to exceed 300%, achieving a console level experience. Full imaging capability: single camera supports up to 320 million pixel CMOS and 108MP@30fps Continuous shooting, dual camera 64MP+32MP to meet professional needs; Top display and encoding/decoding capabilities, supporting 4K/ WQUXGA@120Hz High refresh rate, 8K codec, integrated full format codec covering audio and video scenes. The core highlight is that the Exynos 2600 has implanted a heat dissipation path module (HPB) in a mobile SoC for the first time, using high dielectric constant materials to reduce thermal resistance by up to 16%, solving the pain point of high-end chip heat dissipation. At the same time, as the first 2nm GAA smartphone chip, it is the first to support hybrid quantum encryption to ensure security, and will become the foundation platform for future Exynos chips, laying a technological advantage. 2、 Samsung's mobile phone strategy: Half of the S26 models are equipped with Exynos 2600 for mass production, which is not only a technological breakthrough, but also a heavyweight signal for Samsung to revive its self-developed mobile processor strategy. According to a previous report by the Korea Economic Daily, Samsung plans to equip about half of its Galaxy S26 series models with this chip, which is a radical counterattack measure after its self-developed chip suffered setbacks. According to the plan, the entire Galaxy S26 series (including Ultra version) in the Korean and European markets will be equipped with Exynos 2600, while Qualcomm Snapdragon will still be used in the US, Japan, and China markets. This balanced distribution means that Samsung has deployed Exynos chips on a large scale in its flagship Galaxy series for the first time since 2021, marking a comprehensive return to its self-developed strategy. Looking back at history, Samsung's flagship Galaxy used Exynos chips before 2015, but switched to Qualcomm in 2016. The heat dissipation issue and low yield of the 2022 Galaxy S22 series Exynos chip have dampened consumer confidence and accelerated the transition. Since last year, Samsung has launched a self-developed comeback: the Galaxy S24 Basic/Plus version is equipped with Exynos 2400, and the subsequent Galaxy Z Flip7 (sold only in Korea) is equipped with Exynos 2500, gradually rebuilding trust. The mass production and large-scale adoption of Exynos 2600 is a crucial step for Samsung's return to self-developed technology. This reflects its confidence in its semiconductor capabilities and is also an important measure to restructure the mobile chip market landscape. With its first mover advantage in 2nm technology, Samsung is attempting to regain the voice of high-end mobile chips and reverse its passive situation. As the Galaxy S26 approaches, this direct confrontation with Qualcomm will become the biggest highlight of the high-end mobile phone market in 2025.

Frequently Asked Questions

Question: How do you ensure the quality of the domestic chips you distribute?

Answer: We work with chip manufacturers that have strict quality control systems in place. All chips undergo multiple rounds of testing at the manufacturing stage, including electrical performance testing, reliability testing, and environmental testing. Before delivery, we also conduct sampling inspections to ensure that the products meet our quality standards. Additionally, we offer a quality guarantee period during which we will handle any quality-related issues promptly.

Question: What does the warranty policy for your domestic chips cover?

Answer: Our domestic chips come with a standard warranty period. During this time, if the chip fails due to manufacturing defects, we will provide free repair or replacement services. The warranty does not cover damages caused by improper use, unauthorized modifications, or external factors such as electrical surges or physical damage. To initiate a warranty claim, please contact our customer service team and provide detailed information about the problem and the chip's serial number.

Question: What kind of technical support can I get from you after purchasing your chips?

Answer: Our technical support team consists of experienced engineers who are proficient in chip technology. We offer pre-sales technical consultation to help you select the most suitable chips for your applications. After-sales, we provide assistance in chip integration, debugging, and performance optimization. You can reach out to our technical support hotline or email for any technical issues, and we will respond promptly.

Question: How can I be sure that your domestic chips are compatible with the existing systems and components in my project?
Answer: Our domestic chips are designed with broad compatibility in mind. Before you make a purchase, our technical team can offer in-depth consultations. We will analyze your specific system requirements, including interface types, power consumption, and operating frequencies, and then recommend the most suitable chips. Additionally, we have a library of technical documentation and case studies that showcase successful integrations with a wide range of systems and components, which can help you assess compatibility.
Question: How can I ensure a stable supply of your domestic chips, especially during peak demand periods?

Answer: We maintain close partnerships with multiple domestic chip manufacturers. Through long-term cooperation agreements and inventory management strategies, we strive to meet the demand of our customers. We also closely monitor market trends and adjust our procurement plans in advance to ensure a stable supply. In case of unexpected situations, we will promptly communicate with you and provide alternative solutions.

Latest know-How Articles

Blog From 'available' to 'trusted', GigaDevie GSL6188 fingerprint sensor certified by Microsoft ESS
On December 24th, GigaDevie's GSL6188 MoC (Match on Chip) PC fingerprint recognition sensor has successfully passed the Windows Hello Enhanced Sign in Security authentication. This marks that GigaDevie's software and hardware design and system integration capabilities in the field of high security biometric chips have reached international mainstream standards, providing authoritative endorsement for the product to enter the global market. Windows Hello Enhanced Login Security Certification is a hardware security standard established by Microsoft to enhance the overall login security of Windows devices. It requires hardware such as sensors to have high security features and be able to locally isolate and protect biometric data, providing users with a seamless and high-intensity authentication experience. The GigaDevie GSL6188 fingerprint sensor adopts a highly integrated Match on Chip (MoC) architecture, which achieves excellent performance with FRR less than 1.5% and FAR less than 0.002% through dynamic noise reduction algorithm and multi-scale feature fusion algorithm, surpassing the standard requirements of Microsoft Windows Hello for fingerprint recognition. This product has a highly integrated security architecture, built-in independent microcontroller and secure storage, achieving hardware isolation of fingerprint matching and templates, simplifying peripheral design. In terms of security, GSL6188 pre burns certificates during production and supports TPM 2.0 key management and VBS virtualization for isolated operation, ensuring that the fingerprint authentication process runs in a trusted execution environment. In addition, the product also has strong anti-counterfeiting capabilities. With the help of self-developed deep learning algorithms, it can significantly enhance the defense against 2.5D and 3D forged fingerprints. GigaDevie Vice President and General Manager of Sensor Business Unit, Zhi Jun, stated, "The GSL6188 has passed the Windows Hello Enhanced Login Security Certification, which is an important achievement of GigaDevie's long-term technological investment in high-performance and high security biometric sensing. This demonstrates that our product can meet the stringent security requirements of international advanced PC manufacturers. In the future, we will continue to strive to provide more fingerprint biometric solutions, offering high-quality choices that combine security and convenient user experience to the global market.
Blog Striving to be the "game-changer" in China's analog chip industry, Novosense is heading towards the global market
The chip industry continues to develop, and China's path of independent research and development is thriving. Novosense, as a core enterprise in domestic analog chips, is leading the way. Not only has it continuously increased its market share in China, but it has also become a key player in the global supply chain, and together with a group of outstanding Chinese chip companies, it is changing the industry landscape. How can Chinese chip companies grow from scratch to 1, and then from 1 to 10,000? Recently, Yao Di, Vice President of Novosense, stated in a recent external exchange that Novosense's "Rooted in China, Expanding to the World" relies on systematic capabilities. Currently, the company has already deployed some overseas production capacity, providing leading products to the market based on reliability and efficiency.     Accuracy, reliability, and response efficiency constitute the "moat" of Novosense The competition in the global analog chip market is essentially a dual contest of "performance + trust". Yao Di believes that Novosense has been able to break through from hundreds of domestic enterprises and become a partner of leading enterprises in the global automotive, industrial, and other fields, primarily because it has built a solid "moat" in three dimensions: precision, reliability, and response efficiency. Accuracy is the "core soul" of analog chips, directly determining the "sensory ability" of electronic systems. Yao Di cited the "gain with speed" function of cars as an example. The analog chip needs to first sense physical signals such as vehicle speed and external noise, transmit them to the central control system, and then send instructions to "increase/decrease volume" to the speaker. In this process, the accuracy and sensitivity of signal conversion directly affect the functional experience. "Just like a hand touching a lit candle will immediately withdraw, if the reaction is 1 second slow, the skin tissue may be burned," the analog chip has extremely high requirements for signal response speed and sensitivity. Novosense has deeply invested in high-precision technology, developing chips capable of accurately converting physical signals into electrical signals. Whether it's voltage acquisition for automotive battery management systems or temperature detection for industrial equipment, these chips can meet customers' stringent accuracy requirements. This is one of the key reasons why many customers choose Novosense for their smart driving system collaborations. Reliability is the "bottom line" for analog chips, especially in long-life scenarios such as automotive and industrial applications, where no compromise is acceptable. Yao Di emphasized that while an automobile may only have 1-2 "brains" (main chips), the number of analog chips can range from hundreds to thousands. "If even one of these analog chips malfunctions, the entire system could potentially break down." Moreover, considering that automobiles typically have a lifespan of 10-20 years, these analog chips must also withstand harsh environments such as high temperatures and high-frequency vibrations in the engine compartment. To this end, Novosense has invested significantly more resources than the industry average to establish a reliability control system: the proportion of quality team members has been maintained at 8%-10% for a long time; in the production process, strategic cooperation has been established with leading global wafer fabs and packaging and testing factories to ensure quality from the source; at the same time, a large number of quality resident teams and engineering resident teams have been stationed in foundries for long-term monitoring of the quality of every production process, including encapsulation and pin extraction. Its automotive-grade chips have passed rigorous testing and demonstrated excellent long-term stability, which is why top-tier wafer fabs choose to deeply collaborate with Novosense. Only a reliable design solution can fully leverage the value of advanced manufacturing processes. 03 Response efficiency is a "differentiating advantage" for Novosense and even Chinese chip companies in global competition. Chinese companies possess a "speed" that overseas giants lack. Yao Di mentioned that Novosense can quickly customize and develop products according to customers' personalized needs. This agility is particularly important in the rapid iteration of the automotive industry. Faced with urgent supply demands, Novosense can efficiently leverage supply chain resources such as wafer fabs and packaging factories, and achieve rapid response through a mature collaborative mechanism. This demonstrates the flexibility of delivery in automotive chip applications and lays the foundation for further deepening cooperation.   The analog chip is currently undergoing reliability testing   Novosense hot sale part numbers in the global market:   NSI8210N0-DSPR NSI8210N1-Q1SPR NSi8120N0/NSI8220N0-DSPR NSi8120N1 NSI8220N1-DSPR NSi8141W1 NSI8241W1-DSWR NSi8141S0 NSi8141S1 NSI8260W0-DSWR NSi8261S1-DSSR NSi8262W0-DSWR NSi8262W1-DSWR NSi8100W NSI1050-DDBR (DUB8) NSI1050-DSWR (SOW16) NCA1042-DSPR NCA1051N-DSPR NSD1025-DSPR NSD1624-DSPR NSi6801TC-DDBR (DUB8) NSI6611ASC-Q1SWR NSI1311-DSWVR NSI1300D05-DSWVR NSi1200-DSWVR NSI1306M25-DSWR    
Blog New Product Launch | Chipanalog Microelectronics CA-DV8008 I²C Controlled 8-Channel Low-Side Driver
In the fields of home appliances and industrial control, multi-load drives often face the challenges of limited controller GPIO resources and high system costs. To address this challenge, Chipanalog has officially launched the CA-DV8008—an eight-channel low-side driver controlled by I²C. This device significantly optimizes system resource usage and reduces overall solution costs through an efficient serial-to-parallel control architecture, providing a highly integrated and reliable domestic chip solution for multi-load drive applications.   01 Product Overview   The CA-DV8008 is an eight-channel low-side driver controlled by I²C. This device uses a serial interface to parallel output control method, which can significantly save GPIO resources of the main controller, simplify system design, and effectively reduce hardware costs.   Each channel supports a sinking current capability of 500mA, the output port withstand voltage is up to 50V, and the built-in clamping diode provides a demagnetizing circuit when inductive loads are turned off. It is suitable for driving various loads such as stepper motors, DC motors, relays, and solenoids.   The CA-DV8008 supports a high-speed I²C bus up to 400kHz and has three hardware address configuration pins. It supports up to eight CA-DV8008s connected to the same I²C bus, enabling centralized control of 64 outputs. The SCL and SDA pins use CMOS logic levels, and the logic supply voltage VCC supports a wide input range of 3V to 5.5V, allowing direct connection to 3.3V or 5V microcontrollers and sharing a power supply.   The CA-DV8008 is available in SOIC16-NB and TSSOP16 packages, with an ambient operating temperature (TA) range of -40°C to +125°C, meeting the requirements of household appliances and industrial applications. Simplified Circuit Block Diagram 02 Features   Eight-channel low-side output, single-channel 500mA sink current capability (25°C, single-channel enable), single-channel 250mA sink current capability (25°C, eight-channel enable, SOIC16-NB package), output port voltage up to 50V, built-in clamping diode for inductive loads, input I²C control, supports clock rates up to 400kHz, SCL/SDA pins CMOS logic level, 3 addressable pins, up to 8 CA-DV800 chips can be connected on the same bus, 8VCC power supply voltage range: 3V~5.5V, ambient operating temperature range: –40°C ~ 125°C, available in SOIC16-NB and TSSOP16 package options.   03 Typical Application Scenarios   Motion Control: Stepper motor drive, DC brushed motor drive Power Switches: Relay drive, contactor control, solenoid drive Lighting Systems: Multi-channel LED drive and dimming control Signal Distribution: Line driver, logic buffer and level shifter Home Appliances and Industrial Automation: Multi-channel actuator control, valve drive, electromagnet control   The CA-DV8008 can drive two four-phase five-wire stepper motors. The logic-side power supply VCC can share the same power supply as the microcontroller, supporting a supply voltage range of 3V to 5.5V. During use, SCL and SDA need to be pulled up to VCC through resistors. The device address is set by shorting the A2~A0 pins to VCC or GND. The CA-DV8008 integrates a clamping diode, which is connected to the system's high-voltage power supply during application to provide a freewheeling path when the inductive load is turned off. Typical Application Circuit—Driving Stepper Motors The CA-DV8008 can also be used to drive seven-segment or eight-segment common-anode LED digital tubes. Typical Application Circuit—Driving LED Digital Tubes

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