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September 30, 2025
TSMC's top five customers: reshuffle, biggest dark horse exposure!
TSMC's 2025-2026 Customer Ranking List: The global semiconductor AI application competition is intensifying, and the company estimates that TSMC's 2026 major customer ranking will be reshuffled. Key driver: Broadcom collaborates with OpenAI; Intel partners with Nvidia, outsourcing TSMC orders increase. Apple maintains its core position and is estimated to be TSMC's largest customer by 2024, contributing NT $624.3 billion in revenue (22% of the total). It also guarantees over half of TSMC's 2 nanometer production capacity by 2026, and has taken over all of Baoshan's first 2 nanometer production capacity. Its products may use TSMC's WMCM packaging technology, continuing to be the most advanced and largest user in terms of production capacity. Estimated ranking by revenue share in 2025: Apple (25% -27%), Nvidia (11%), MediaTek (9%), Qualcomm (8%), AMD AMD AMD (7%), Broadcom (7%), Intel (6%). Estimated rankings for 2026: Apple (22% -25%) remains at the top, Broadcom (11% -15%) jumps from sixth to second, and Nvidia (11%) drops to third; Intel's market share is expected to catch up with Qualcomm and AMD AMD (7%). In addition, American customers have strong demand for advanced processes, urging TSMC to expand production at its new factory in the United States. TSMC plans to build multiple wafer fabs in the United States, with overseas production capacity accounting for 20% by 2028 and a ratio of approximately 7:3 between Taiwan and the United States for processes below 2 nanometers by 2030, in order to meet customers' needs for off-site backup. TSMC has never commented on individual customer messages.
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  • September 25, 2025
    NVIDIA invests $100 billion in OpenAI!
    On September 22nd, Nvidia and OpenAI announced a partnership that includes plans to build a massive data center and Nvidia's largest investment commitment to OpenAI, up to $100 billion (approximately 711.5 billion yuan). According to the agreement, OpenAI will utilize Nvidia systems to build and deploy at least 10 gigawatts of AI data centers for training and running next-generation models. 10 gigawatts is equivalent to 4 to 5 million graphics processing units (GPUs), which is roughly equal to Nvidia's total shipments this year and twice as much as last year. This is a massive project, "Nvidia CEO Renxun Huang, OpenAI CEO Altman, and President Brockman said in an interview. Both parties stated that Nvidia will gradually invest with the launch of each gigawatt data center, with the first phase expected to be launched in the second half of 2026, based on Nvidia's Vera Rubin platform. The details of the cooperation will be finalized in the coming weeks. OpenAI currently has over 700 million weekly active users, and its ChatGPT service requires massive computing power support. OpenAI CEO Sam Altman stated in a statement, "It all starts with computing power. Computing infrastructure will become the foundation of the future economy, and we will leverage the technology system we have built together with NVIDIA to achieve new breakthroughs in the field of artificial intelligence on one hand, and empower individuals and businesses with these technologies on a large scale on the other." This investment has significant strategic implications for NVIDIA. Bryn Talkington, Managing Partner of Requisite Capital Management, told the media: "Nvidia investing $100 billion in OpenAI, and then OpenAI returning the money to Nvidia, will be a very virtuous cycle for Huang Renxun. This collaboration will help Nvidia ensure that its devices remain at the core of AI system construction, especially in the context of OpenAI's foray into the hardware field, including self-developed chips. Maintaining OpenAI as a major client may help Nvidia consolidate its market position when considering competitor components in the industry. However, some people have raised concerns about this collaboration, believing that it may harm the competitive landscape of the industry. Andre Barlow, an antitrust lawyer at Doyle, Barlow&Mazard law firm, pointed out that this collaboration may bundle Nvidia's monopoly advantage in the chip field with OpenAI's leading position in software, making it more difficult for Nvidia's competitors in the chip field (such as AMD) or OpenAI's competitors in the large model field to scale up. Recently, Nvidia has frequently invested in industry related companies. Last week, Nvidia announced a $5 billion investment in Intel and will collaborate with them to develop chips. In addition, Nvidia has invested approximately $700 million in UK data center startup Nscale to build a UK version of Stargate, enhancing the country's autonomous computing capabilities.
  • September 22, 2025
    Infineon ranks first in the automotive semiconductor rankings
    French market research company Yole Group released its latest report on the global automotive semiconductor market on July 31, 2025. The report shows that the size of the automotive semiconductor market will reach 68 billion US dollars in 2024, with Infineon Technologies (hereinafter referred to as "Infineon") leading the way.    The compound annual growth rate in 2030 will reach 12%, reaching 132 billion US dollars     The report predicts that the global automotive semiconductor market will grow at a compound annual growth rate of 12% from 2024 to 2030, reaching $132 billion by 2030. It is expected that the price of semiconductor devices per vehicle will increase from approximately $759 in 2024 to approximately $1332 in 2030, and the installation quantity per vehicle is expected to increase from approximately 824 units in 2024 to approximately 1158 units in 2030. 2024 and 2030 Automotive Semiconductor Market Source: Yole Group Yole listed three 'structural factors' that support this growth. One reason is the increasing adoption of power electronic devices, especially wide bandgap (WBG) semiconductor switches, due to electrification. Another issue is that the Euro NCAP 2026 agreement, mandatory requirements for Automatic Emergency Braking (AEB) in the United States, and upgrades to China's C-NCAP (China New Car Assessment Program) will result in the addition of cameras, radars, and domain controllers to all vehicle models (including entry-level models). Finally, the development of E/E (electrical/electronic) architecture will lead to a shift towards centralized systems and a shift towards 48V power supply systems, which will require advanced MCUs and a new set of PMICs in the coming years. Although the growth of battery electric vehicles (BEVs) is slowing down in all major markets (partly due to revised emission regulations in Europe encouraging car manufacturers to expand the scale of BEVs), Yole expects dual motor plug-in hybrid vehicles (PHEVs) to be promoted globally starting from China. Yole expects that dual motor plug-in hybrid electric vehicles (PHEVs) will be promoted globally in the future, starting with China. The company predicts that the average growth rate of PHEVs will reach 19% between 2024 and 2030, while the growth rate of BEVs will only be 14%. The company also explained the recent rapid decline in prices of N-type silicon carbide substrates, stating that the price drop is expanding the application of silicon carbide (SiC) MOSFETs in inverters: not only BEVs, but also PHEVs equipped with large capacity batteries are using SiC combined with an 800 V platform for fast charging. Yole also pointed out that "as global manufacturers catch up, the dominant position of Chinese automakers will shrink. Yole added, "Artificial intelligence is changing all industries, including the automotive industry, without exception. Multimodal interfaces, end-to-end, and visual language action (VLA) models for advanced driver assistance systems (ADAS) are among the first applications, and the use of artificial intelligence in more areas such as development, manufacturing, marketing, and aftermarket is becoming increasingly widespread. ”The report also points out that the application of artificial intelligence in more fields such as development, manufacturing, marketing, and after-sales markets is becoming increasingly widespread.     The top five companies in the 02 ranking account for about half of the total     According to the 2024 ranking of the automotive semiconductor market, the leader Infineon dominates the silicon (Si) and SiC power module, driver, and MCU fields, with sales exceeding $8 billion and a market share of 12%. NXP Semiconductor (NXP) ranks second and has advantages in automotive network MCUs, radars, and transceivers, with a market share of 10%. STMicroelectronics (ST), ranked third, holds a 9% market share. Yole explained that STMicroelectronics' goal is long-term growth and maintaining its dominant position in the discrete, electrification, and MCU platforms. ” According to Yole's report, the ranking is closely followed by Texas Instruments (TI) in fourth place and Renesas Electronics in fifth place. Yole stated that these five companies account for approximately 50% of the automotive semiconductor market, but also emphasized that "new challengers are rapidly expanding". Top 10 Participants in the Automotive Semiconductor Market in 2024 Source: Yole Group China suggests that car manufacturers increase the localization rate of automotive components to 25% by 2025, and Yole explains that "the face of the automotive industry is already changing. Chinese semiconductor manufacturer Horizon Robotics SiEngine、 Black sesame is used in cockpits and ADAS, while BYD Semiconductor and StarPower have been adopted by domestic automakers in some Si IGBT and SiC MOSFET fields. Even with vertical integration by car manufacturers, NIO has produced its own 1000 TOPS domain controller using TSMC's 5nm process. BYD also combines its own MCU and SiC MOSFET with its own battery pack. Yole said, "Not only these examples, but several other car manufacturers are also taking similar paths." In terms of production capacity, SMIC is building four 12 inch factories with 28nm/40nm nodes that can process about 100000 wafers per month. Undoubtedly, China's advantages lie in its domestic policies, expanded manufacturing capabilities, and agile vertical integration, "Yole said. On the other hand, in the field of 16nm and below processes, it is said that there is competition between TSMC and Samsung's two foundries. TSMC's N5A and Samsung's SF5A are currently the most advanced processes that comply with the AEC-Q100 standard, "Yole explained. Regarding this, capacity allocation has become the axis of competition. Yole stated that "Nvidia's' Thor ', Qualcomm's' Snapdragon Ride', and Mobileye's' EyeQ7 'have ensured the majority of production capacity for products using 5nm technology by 2027. Yole also mentioned in the report that American companies hold a 36% market share. The main areas are simulation, memory, and high-end SoC (System on Chip) solutions. Yole stated that "Nvidia, AMD, and Qualcomm are introducing AI computing to the automotive edge, and future growth will depend on SoC penetration in advanced driver assistance systems (ADAS), autonomous driving, and cockpit computing. ”Regarding Japanese companies, Pierrick Boulay, Chief Analyst of Yole Automotive Semiconductors, explained, "In Japan, apart from Renesas, ROHM and Denso have maintained a strong position in the traditional MCU, sensor, and silicon carbide power device fields. ROHM and Denso are growing in the SiC MOSFET used in electric vehicle inverters

Frequently Asked Questions

Question: How do you ensure the quality of the domestic chips you distribute?

Answer: We work with chip manufacturers that have strict quality control systems in place. All chips undergo multiple rounds of testing at the manufacturing stage, including electrical performance testing, reliability testing, and environmental testing. Before delivery, we also conduct sampling inspections to ensure that the products meet our quality standards. Additionally, we offer a quality guarantee period during which we will handle any quality-related issues promptly.

Question: What does the warranty policy for your domestic chips cover?

Answer: Our domestic chips come with a standard warranty period. During this time, if the chip fails due to manufacturing defects, we will provide free repair or replacement services. The warranty does not cover damages caused by improper use, unauthorized modifications, or external factors such as electrical surges or physical damage. To initiate a warranty claim, please contact our customer service team and provide detailed information about the problem and the chip's serial number.

Question: What kind of technical support can I get from you after purchasing your chips?

Answer: Our technical support team consists of experienced engineers who are proficient in chip technology. We offer pre-sales technical consultation to help you select the most suitable chips for your applications. After-sales, we provide assistance in chip integration, debugging, and performance optimization. You can reach out to our technical support hotline or email for any technical issues, and we will respond promptly.

Question: How can I be sure that your domestic chips are compatible with the existing systems and components in my project?
Answer: Our domestic chips are designed with broad compatibility in mind. Before you make a purchase, our technical team can offer in-depth consultations. We will analyze your specific system requirements, including interface types, power consumption, and operating frequencies, and then recommend the most suitable chips. Additionally, we have a library of technical documentation and case studies that showcase successful integrations with a wide range of systems and components, which can help you assess compatibility.
Question: How can I ensure a stable supply of your domestic chips, especially during peak demand periods?

Answer: We maintain close partnerships with multiple domestic chip manufacturers. Through long-term cooperation agreements and inventory management strategies, we strive to meet the demand of our customers. We also closely monitor market trends and adjust our procurement plans in advance to ensure a stable supply. In case of unexpected situations, we will promptly communicate with you and provide alternative solutions.

Latest know-How Articles

Blog Continental Group collaborates with Novesense to create safer automotive pressure sensor chips
Continental Group collaborates with Novesense to create safer automotive pressure sensor chips   On October 24, 2024, the 2024 Continental China Experience Day, hosted by Continental Group, was held in Gaoyou City, Jiangsu Province. Nearly 200 guests from the upstream and downstream of the automotive industry chain were invited to attend the conference and engage in in-depth dialogue on the collaborative development and future trends of the automotive industry, jointly exploring future market forms and opportunities. Wang Shengyang, founder, chairman, and CEO of Novosense, and Dr. Zhao Jia, director of Novosense Sensor Product Line, were invited to attend. During the event, Novosense and Continental Group announced a strategic partnership to jointly develop automotive pressure sensor chips.   In this collaboration, both parties will focus on jointly developing automotive grade pressure sensor chips with functional safety features. The newly developed pressure sensor chip will be based on Continental's next-generation global platform, with a focus on improving reliability and accuracy. It can be used to achieve safer and more reliable systems for automotive airbags, side collision monitoring, and battery pack collision monitoring.
Blog ovosense micro car specification level 4/8-way half bridge drive NSD360x-Q1
Novosense micro car specification level 4/8-way half bridge drive NSD360x-Q1: multi load compatibility, enhancing the flexibility of automotive domain control systems     The Novosense NSD3604/8-Q1 series multi-channel half bridge gate driver chip covers 4/8 half bridge drivers and can drive at least 4 DC brushed motors, achieving multi-channel high current motor driving. It can also be used as a multi-channel high side switch driver. Very suitable for multi motor or multi load applications, such as car window lifting, electric seats, door locks, electric tailgates, and proportional valves for body control applications.     ◆ Wide operating voltage: 4.9V-37V (maximum 40V) ◆ 4, 8-channel half bridge gate drive ◆ Configurable timing charge discharge current drive (CCPD), optimized EMC performance ◆ Integrated 2-level charge pump for 100% PWM ◆ Integrated 2-channel programmable wide mode op amp  
Blog National Technology Invited to Participate in 2024 Intel
Draw a blueprint together! National Technology Invited to Participate in 2024 Intel ®  LOEM Summit November 5-7, 2024, Intel 2024 ®  The LOEM Summit was grandly held in Bangkok, Thailand, and National Technology Co., Ltd. (hereinafter referred to as "National Technology"), as Intel's global partner, was invited to participate in the summit. This summit provides an important platform for 200 Intel business partners from around the world to enhance communication and connection, share development experiences, and actively explore new opportunities in the future. Taking this opportunity, National Technology showcased its fourth generation trusted computing chip NS350, high-precision metering battery management chip NB401, and related application cases at the summit, showcasing its product capabilities.   NS350 is the fourth generation trusted computing chip of National Technology, which has advantages such as high security, high performance, and great value. It is designed based on 40nm process, supports I2C and SPI interfaces, and provides packaging forms such as QFN32 and QFN16. It complies with China's TCM2.0 trusted password module standard (GM/T 0012-2020) and the international TPM2.0 (Spec 1.59) trusted computing standard. The chip has passed the CC security function testing and security assurance assessment by the international third-party authoritative testing agency THALES/CNES, and has obtained the CC EAL4+certification certificate issued by the French National Agency for Information Systems Security (ANSSI). The chip is compatible with international mainstream operating systems such as Windows, Linux, BSD UNIX, as well as domestic operating systems such as Galaxy Kirin, Tongxin, Fangde, and Shenzhou NetEase Government Edition Windows. It can be used in fields such as PC, server platforms, and embedded systems to protect information system security and effectively resist various attacks from the network. The national technology collaborative negative electrode material business develops electrochemical battery measurement algorithms, with core technological advantages supporting battery safety measurement and industry-leading high-precision SOC measurement algorithms. It provides AFE, MCU, BMS, and algorithm overall solutions for the consumer, industrial, and automotive electronics fields.   NB401 is a high-precision metering battery management chip launched by National Technology for the consumer market. The product integrates a high-precision power calculation method and has multiple functions such as battery monitoring, metering, protection, and certification. It can support the management and metering of 2-4 series of lithium-ion batteries or lithium polymer batteries. The chip integrates two 16 bit high-precision ADCs for voltage (or temperature) and current acquisition, as well as hardware protection and wake-up functions. It supports SMBus communication, intelligent charging management, and multiple safety certifications, with ultra-low power consumption characteristics, which can meet the needs of most battery management or metering applications in the consumer electronics field. It is suitable for battery pack applications in electronic devices such as laptops, tablets, mobile phones, cameras, drones, power tools, and power banks.

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