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June 09, 2025

17.2 billion yuan! The semiconductor giant just announced

Qualcomm agreed to acquire British semiconductor company Alphawave IP Group on Monday. Qualcomm said the enterprise value of the transaction is approximately US$2.4 billion (approximately RMB 17.2 billion). Under the terms of the acquisition, each AlphaWave shareholder will be entitled to receive $2.48 in cash for each share of AlphaWave stock. AlphaWave said the board of directors unanimously recommended that AlphaWave shareholders vote in favor of the plan. It is reported that after two months of negotiations, Alphawave agreed to accept Qualcomm's $2.4 billion acquisition offer. The price is equivalent to 183 pence per share (approximately RMB 16.07), a 96% premium over the company's closing price of 93.50 pence (approximately RMB 9.09) on March 31 (the day before Qualcomm announced its acquisition intention). Alphawave focuses on developing high-speed semiconductors and connection technologies for data centers and artificial intelligence applications. Alphawave designs and licenses semiconductor technology for data centers, networks, and storage. Its "serializer/deserializer" (SerDes) technology attracted acquisition interest from Qualcomm and SoftBank's chip technology provider Arm in early April. But according to previous reports in April, Arm withdrew after preliminary discussions with Alphawave. SerDes technology is an indispensable part of artificial intelligence applications. Chatbots like ChatGPT usually require thousands of chips to work together to ensure smooth operation. As one of Broadcom's core competitive advantages, SerDes is a key factor in winning AI customers such as Google and OpenAI.

June 06, 2025
TI plans to increase prices for some product lines
TI plans to increase prices for some product lines, effective from June 15th. The average price increase this time is over 10%, with some part numbers experiencing a price increase of 40-70% or more. The price increase materials are mainly concentrated in three types of products: low profit margins, old part numbers, and promised quantities that have not been met. This is a global price increase, not only for the China region. The price increase in the China region is mainly for low profit margin products, involving part numbers such as operational amplifiers and interface ADCs.
June 04, 2025
Chipanalog CA-PM4644BA four-channel fully integrated multi-phase DCDC micromodule
In the era of high-density integration of digital circuits, the efficiency, flexibility and reliability of power supply systems have become core challenges. Chipanalog has launched a new CA-PM4644BA wide voltage input four-channel DC/DC buck converter module, which provides high-precision power supply solutions for FPGA, communication storage and other scenarios with three advantages: multiple outputs, flexible expansion and ultra-high integration. 01 Product Overview CA-PM4644BA is a step-down DC/DC converter with wide input voltage and 4A output for all four channels. The four channels can also be used in parallel to provide a maximum output current of 16A. The device adopts BGA77 package, and integrates switch control circuit, power MOSFET, power inductor, decoupling capacitor and other circuit components. Therefore, only a few external components are required, such as input capacitor, output capacitor, feedback resistor, etc., to form a complete step-down four-way DC/DC regulator. The input voltage range of CA-PM4644BA is 4V~15V, and the output voltage can be set in the range of 0.6V~5.5V by changing the feedback external resistor. CA-PM4644BA application circuit is often used as a load power supply, which can provide high-precision voltages of different specifications such as 1.0V, 1.2V, 1.5V, 1.8V, 3.3V, 5V, etc. for digital circuits in the whole system, such as FPGA control circuits, motherboards and CPUs, communication storage and other circuits, and provide a maximum output current of 4A. CA-PM4644BA can also flexibly configure 4 channels for parallel use, continuously providing output currents of up to 8A (two-phase parallel) and 16A (four-phase parallel). 02 Features Multiple outputs, flexible expansion: one "core" meets the needs of multiple scenarios Four-channel independent power supply: single-channel 4A output capacity, four channels can independently power different loads (such as 1.8V/3.3V/5V multi-voltage requirements). Parallel output up to 16A: Four channels can be flexibly connected in parallel, supporting 8A (two-phase) and 16A (four-phase) high current output, suitable for high-power core power supply such as CPU/GPU. Wide voltage coverage: input 4V-15V, output 0.6V-5.5V adjustable, accurately matching the power supply requirements of digital circuits. Highly integrated design: Simplify the system and save space. BGA77 package (9mm×15mm×5.01mm), internally integrated switching circuits, MOSFET, inductors, capacitors and other core components, only a small amount of resistors and capacitors are required on the periphery to work. Reduce PCB area occupation and help high-density circuit design. Efficient and stable: A reliable choice in harsh environments. Efficiency is as high as 95% (5V input, 3.3V/1A output), reducing system power consumption and temperature rise. ±1.5% output voltage accuracy, combined with COT control mode, to achieve fast dynamic response and low ripple. -40℃~125℃ wide temperature operation, supporting industrial and automotive environment applications. Multiple protections: Built-in input overvoltage protection, output overcurrent/overvoltage protection, support soft start and temperature monitoring functions to protect the system from damage to the equipment under abnormal conditions. 03 Typical application scenarios FPGA/ASIC power supply: provides 1.0V/1.2V low voltage, high-precision power supply for multi-core processors and logic units. Communication base station and server: Supports multi-channel power management for 5G base station BBU and data center storage modules.

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Question: How do you ensure the quality of the domestic chips you distribute?

Answer: We work with chip manufacturers that have strict quality control systems in place. All chips undergo multiple rounds of testing at the manufacturing stage, including electrical performance testing, reliability testing, and environmental testing. Before delivery, we also conduct sampling inspections to ensure that the products meet our quality standards. Additionally, we offer a quality guarantee period during which we will handle any quality-related issues promptly.

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Question: What does the warranty policy for your domestic chips cover?

Answer: Our domestic chips come with a standard warranty period. During this time, if the chip fails due to manufacturing defects, we will provide free repair or replacement services. The warranty does not cover damages caused by improper use, unauthorized modifications, or external factors such as electrical surges or physical damage. To initiate a warranty claim, please contact our customer service team and provide detailed information about the problem and the chip's serial number.

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Answer: Our domestic chips are designed with broad compatibility in mind. Before you make a purchase, our technical team can offer in-depth consultations. We will analyze your specific system requirements, including interface types, power consumption, and operating frequencies, and then recommend the most suitable chips. Additionally, we have a library of technical documentation and case studies that showcase successful integrations with a wide range of systems and components, which can help you assess compatibility.

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Answer: We maintain close partnerships with multiple domestic chip manufacturers. Through long-term cooperation agreements and inventory management strategies, we strive to meet the demand of our customers. We also closely monitor market trends and adjust our procurement plans in advance to ensure a stable supply. In case of unexpected situations, we will promptly communicate with you and provide alternative solutions.

Latest know-How Articles

Blog Continental Group collaborates with Novesense to create safer automotive pressure sensor chips

Continental Group collaborates with Novesense to create safer automotive pressure sensor chips On October 24, 2024, the 2024 Continental China Experience Day, hosted by Continental Group, was held in Gaoyou City, Jiangsu Province. Nearly 200 guests from the upstream and downstream of the automotive industry chain were invited to attend the conference and engage in in-depth dialogue on the collaborative development and future trends of the automotive industry, jointly exploring future market forms and opportunities. Wang Shengyang, founder, chairman, and CEO of Novosense, and Dr. Zhao Jia, director of Novosense Sensor Product Line, were invited to attend. During the event, Novosense and Continental Group announced a strategic partnership to jointly develop automotive pressure sensor chips. In this collaboration, both parties will focus on jointly developing automotive grade pressure sensor chips with functional safety features. The newly developed pressure sensor chip will be based on Continental's next-generation global platform, with a focus on improving reliability and accuracy. It can be used to achieve safer and more reliable systems for automotive airbags, side collision monitoring, and battery pack collision monitoring.

Blog ovosense micro car specification level 4/8-way half bridge drive NSD360x-Q1

Novosense micro car specification level 4/8-way half bridge drive NSD360x-Q1: multi load compatibility, enhancing the flexibility of automotive domain control systems The Novosense NSD3604/8-Q1 series multi-channel half bridge gate driver chip covers 4/8 half bridge drivers and can drive at least 4 DC brushed motors, achieving multi-channel high current motor driving. It can also be used as a multi-channel high side switch driver. Very suitable for multi motor or multi load applications, such as car window lifting, electric seats, door locks, electric tailgates, and proportional valves for body control applications. ◆ Wide operating voltage: 4.9V-37V (maximum 40V) ◆ 4, 8-channel half bridge gate drive ◆ Configurable timing charge discharge current drive (CCPD), optimized EMC performance ◆ Integrated 2-level charge pump for 100% PWM ◆ Integrated 2-channel programmable wide mode op amp

Blog National Technology Invited to Participate in 2024 Intel

Draw a blueprint together! National Technology Invited to Participate in 2024 Intel ® LOEM Summit November 5-7, 2024, Intel 2024 ® The LOEM Summit was grandly held in Bangkok, Thailand, and National Technology Co., Ltd. (hereinafter referred to as "National Technology"), as Intel's global partner, was invited to participate in the summit. This summit provides an important platform for 200 Intel business partners from around the world to enhance communication and connection, share development experiences, and actively explore new opportunities in the future. Taking this opportunity, National Technology showcased its fourth generation trusted computing chip NS350, high-precision metering battery management chip NB401, and related application cases at the summit, showcasing its product capabilities. NS350 is the fourth generation trusted computing chip of National Technology, which has advantages such as high security, high performance, and great value. It is designed based on 40nm process, supports I2C and SPI interfaces, and provides packaging forms such as QFN32 and QFN16. It complies with China's TCM2.0 trusted password module standard (GM/T 0012-2020) and the international TPM2.0 (Spec 1.59) trusted computing standard. The chip has passed the CC security function testing and security assurance assessment by the international third-party authoritative testing agency THALES/CNES, and has obtained the CC EAL4+certification certificate issued by the French National Agency for Information Systems Security (ANSSI). The chip is compatible with international mainstream operating systems such as Windows, Linux, BSD UNIX, as well as domestic operating systems such as Galaxy Kirin, Tongxin, Fangde, and Shenzhou NetEase Government Edition Windows. It can be used in fields such as PC, server platforms, and embedded systems to protect information system security and effectively resist various attacks from the network. The national technology collaborative negative electrode material business develops electrochemical battery measurement algorithms, with core technological advantages supporting battery safety measurement and industry-leading high-precision SOC measurement algorithms. It provides AFE, MCU, BMS, and algorithm overall solutions for the consumer, industrial, and automotive electronics fields. NB401 is a high-precision metering battery management chip launched by National Technology for the consumer market. The product integrates a high-precision power calculation method and has multiple functions such as battery monitoring, metering, protection, and certification. It can support the management and metering of 2-4 series of lithium-ion batteries or lithium polymer batteries. The chip integrates two 16 bit high-precision ADCs for voltage (or temperature) and current acquisition, as well as hardware protection and wake-up functions. It supports SMBus communication, intelligent charging management, and multiple safety certifications, with ultra-low power consumption characteristics, which can meet the needs of most battery management or metering applications in the consumer electronics field. It is suitable for battery pack applications in electronic devices such as laptops, tablets, mobile phones, cameras, drones, power tools, and power banks.

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