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RS2227XN TS3A44159RGTR alternative part Si8645BB-B-IS alternative part Si8640BB-B-IS replace part NSi8240W0-DSWR ADUM6403CRW alternative chip CA-IS3643HVW ADUM263N0BRIZ replacement chip ISO7763FDW alternative chip CA-IS3720LS
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MCU MCU

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MCU
Nation( NSING) MCU chip product introduction In the fiercely competitive semiconductor market, NSING chips have opened up a niche market for themselves with a series of significant features and unique advantages, making them the preferred solution for a wide range of electronic applications.   1. High performance computing 2. Low power design 3. Strengthen security 4. Wide compatibility 5. Powerful reliability 6. Cost effectiveness   Despite the high-end functionality and performance of the Nation( NSING) chip, its price is competitive. This cost-effectiveness makes them an attractive choice for large manufacturers and small and medium-sized enterprises. By providing excellent cost-effectiveness, these chips help businesses reduce production costs without compromising quality or performance.   In summary, the Nation( NSING) chip combines high-performance computing, low-power design, enhanced security, broad compatibility, powerful reliability, and cost-effectiveness. These characteristics and advantages make it a leading choice in the semiconductor market, enabling innovation and driving the development of various electronic applications in different industries.
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Sensor
  Product Introduction of Novosense's Sensor Electronic Components:   In the dynamic realm of sensor technology, Novosense has established itself as a leading innovator, offering a diverse range of sensor electronic components that are characterized by outstanding features and numerous advantages. These sensors are designed to meet the complex requirements of various industries, enabling precise measurement and reliable data acquisition.   1. High Precision and Accuracy 2. Wide Measurement Range 3. Fast Response Time 4. Low Power Consumption 5. High Integration 6. Excellent EMC Performance 7. Robustness and Reliability   Novosense's sensor electronic components offer a combination of high precision, wide measurement range, fast response time, low power consumption, high integration, excellent EMC performance, and robustness. These features and advantages make them an ideal choice for a wide range of applications across industries, enabling accurate and reliable sensing solutions.  
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Power Management (PMIC)
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Analog-Digital Converter(ADC)
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Amplifier
  Product Introduction of RUNIC Amplifier Chips:   In the dynamic world of semiconductor technology, RUNIC's amplifier chips have emerged as a remarkable solution, boasting a plethora of features and advantages that cater to a wide spectrum of applications.   1. High - Fidelity Signal Amplification 2. Wide Bandwidth Performance 3. Low Noise Operation 4. High Gain and Efficiency 5. Robustness and Reliability   RUNIC amplifier chips are designed to be versatile and compatible with a wide range of applications. They can be easily integrated into different types of circuits, whether it's a simple audio amplifier circuit or a complex RF front - end module. The chips are available in various package types, allowing for flexible installation and integration into different system designs. This versatility makes them a popular choice among designers in different industries, as they can use the same chips across multiple projects with minimal modifications.   RUNIC amplifier chips combine high - fidelity signal amplification, wide bandwidth, low noise operation, high gain and efficiency, robustness, and versatility. These features and advantages make them a top - notch choice in the amplifier chip market, enabling innovation and high - performance operation in a diverse range of electronic applications.
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Comparator
  Product Introduction of RUNIC's Comparator Chips:   In the ever - evolving landscape of semiconductor technology, RUNIC's comparator chips have emerged as a powerful solution, offering a host of features and advantages that set them apart in the market. These chips are designed to meet the diverse needs of modern electronic systems, providing reliable and high - performance signal comparison capabilities. 1. High - Speed Operation 2. Low Offset Voltage 3. Wide Supply Voltage Range 4. Low Power Consumption 5. High Input Impedance 6. Robustness and Reliability   RUNIC's comparator chips offer a combination of high - speed operation, low offset voltage, wide supply voltage range, low power consumption, high input impedance, and robustness. These features and advantages make them an excellent choice for a wide range of applications, from consumer electronics to industrial and automotive systems, enabling accurate and efficient signal comparison in various electronic designs.
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Logic IC
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Buffer IC
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Interface IC
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Driver IC
  Product Introduction of Driver ICs from Chipanalog & Novosense:   In the realm of semiconductor technology, driver ICs play a crucial role in enabling the efficient operation of various electronic components. Chipanalog and Novosense have emerged as leading providers of driver ICs, each offering a range of products with distinct features and remarkable advantages.   Chipanalog Driver ICs: 1. High - Current Driving Capability 2. Precise Timing Control 3. Low - Voltage Operation 4. Robust Protection Features   Novosense Driver ICs: 1. High - Speed Switching 2. High - Integration Design 3. Wide Operating Temperature Range 4. Good EMC Performance   Both Chipanalog and Novosense offer high - quality driver ICs with unique strengths. Chipanalog's driver ICs are characterized by high - current driving, precise timing control, low - voltage operation, and robust protection, while Novosense's driver ICs stand out with high - speed switching, high - integration design, wide operating temperature range, and good EMC performance. These features make their driver ICs well - suited for a diverse range of applications, from consumer electronics to industrial and automotive systems.
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HBM - Human Discharge Model
February 10, 2025
HBM - Human Discharge Model
HBM stands for Human Body Model, which is commonly known as the human discharge model in ESD electrostatic discharge. It characterizes the chip's anti-static ability, and electronic engineers know that the higher this parameter, the stronger the chip's anti-static ability. However, different chip suppliers usually select different testing standards based on their own understanding, experience, partner resources, or the applicable application scenarios of the chip. Different standards mean that there will be differences in testing methods or conditions, and it is not possible to directly compare the anti-static ability of the chip based on the HBM numbers marked in the specification sheet. At present, the commonly used testing standards for non automotive chips include ANSI/ESDA/JEDEC JS-001 and MIL-STD-883, while automotive chips will use the AEC Q100-002 standard. ANSI(American National Standards Institute)， The American National Standards Institute; ESDA(Electrostatic Discharge Association)， The American Electrostatic Discharge Association; JEDEC(Joint Electron Device Engineering Council)， The Solid State Technology Association; MIL-STD(US Military Standard)， That is, the US military emblem. Specific testing plans for HBM using these standards can be found online. Through comparison, it can be seen that the RC values selected for the three standard tests are all R=1.5k Ω C=100pF， There is no significant difference in the peak current and current waveform tested, but the number of pulses and the time interval between pulses tested are completely different It can be seen that there is a huge difference in HBM data, because the influence of packaging materials on ESD parameters is very small, and the anti-static ability of chips under the same grain size should be comparable. The MIL-STD-883 standard is more stringent than the other two standards, and the test data will be even smaller. Of course, more strictly speaking, taking samples from the same batch and using different testing standards for testing will make the data more convincing. Comparison data provided by electronic enthusiasts can also be found online. In summary, MIL-STD-883 standard is the most stringent and the HBM data tested is smaller; The HBM data tested according to ANSI/ESDA/JEDEC JS-001 standard will be relatively large. It should be emphasized here that the standards followed for ESD testing of chips are completely different from those followed for ESD testing of whole machine products, and the energy level of static electricity is even more different. Therefore, it is not possible to directly use the ESD testing equipment of the whole machine to conduct ESD testing on chip pins. In system level circuit design, especially at external interfaces, special attention should be paid to anti-static and anti surge protection. These integrated chips are relatively delicate and cannot be expected to play the role of discrete protective devices.
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  • February 10, 2025
    Chip Knowledge - MSL (Moisture Sensitivity Level)
      MSL stands for Moisture Sensitivity Level, which characterizes the ability of a chip to withstand humid environments. It is an extremely important parameter that is often overlooked by electronic engineers. Usually, chips exposed in an open environment will absorb moisture, which may enter the plastic packaging of the chip through the pins. During SMT reflow soldering, the moisture expands due to the instantaneous high temperature, and there is a probability of the so-called "POPCORN" phenomenon occurring. Classification of humidity sensitivity levels According to the JEDEC J-STD-020D standard, MSL is classified into 8 levels, as follows: MSL1 Level - Unlimited workshop life up to and including 30 ° C/85% RH MSL2 level - workshop lifespan of less than or equal to 30 ° C/60% RH for one year MSL2a level - workshop lifespan less than or equal to 30 ° C/60% RH for four weeks MSL3 level - workshop life less than or equal to 30 ° C/60% RH 168 hours MSL4 level - workshop life less than or equal to 30 ° C/60% RH 72 hours MSL5 level - workshop life less than or equal to 30 ° C/60% RH 48 hours MSL Level 5a - Workshop life of less than or equal to 30 ° C/60% RH for 24 hours MSL6 level - immediate workshop life less than or equal to 30 ° C/60% RH (for level 6, components must be baked before use and must be reflow soldered within the time limit specified on the moisture sensitive label) It is particularly important to note that if the ambient temperature or air humidity exceeds the limit test conditions for the corresponding level, the chip can be exposed to an open environment for a shorter period of time than the time specified in the standard. The impact of humidity sensitivity level and protective measures Once moisture enters the interior of the chip, there is a probability that sufficient steam pressure will be generated during SMT to damage or destroy the components. Common damage situations include internal separation (delamination) of the plastic body from the chip or pin frame, damage to the bonding wire soldering, chip damage, or cracks appearing inside the chip (which cannot be observed on the chip surface). The most serious situation is chip swelling and bursting (known as the "popcorn" effect). In addition, after moisture enters the interior of the chip, it may also cause electrochemical corrosion. Water vapor may be ionized to generate hydroxide ions when powered on, and the hydroxide ions may react chemically with the bonding pad or even the metal layer inside the chip, resulting in the formation of hydrated oxides. The oxides will also absorb some of the water vapor, creating fragile parts at the interface between the packaging resin and the metal, leading to bonding failure. If there are potassium, sodium, and chloride ions in the moisture, it will greatly increase the probability of corrosion of the chip, lead frame, and PAD, leading to delamination or peeling. After stratification occurs, the difficulty of moisture invasion is greatly reduced, and the reliability of the chip will also be greatly reduced.         Considering both cost and actual production process control, most chips will be packaged with MSL3 humidity sensitive grade and vacuum sealed bags, while desiccants and humidity sensitive cards will be placed inside. After unpacking the chip, it is necessary to complete the surface mounting and testing as soon as possible, and then apply coatings such as three proof paint for moisture sensitive protection. Once the vacuum bag leaks, the moisture sensitive card changes color, or the package is left for too long after unpacking, it is necessary to perform baking actions according to standard procedures before use to ensure the safety of chip use. Runshi Technology's automotive standard products Runshi Technology's automotive products all use MSL1 grade, and some industrial grade products also use MSL1 grade to better cope with the harsh operating or production environments of different product systems. Cost and quality are like the trade-off between fish and bear's paw. The higher the humidity sensitivity level, the higher the cost of packaging materials and processes, and the more expensive the chip price. Electronic engineers need to choose an acceptable cost, that is, the quality level of the chip, based on SMT production control capabilities, the working environment of the finished product, and market positioning when selecting.
  • February 10, 2025
    12 bit low-power analog-to-digital conversion chip RS1320
    12 bit low-power analog-to-digital conversion chip RS1320 RS1320 is a low-power single channel 12 bit analog-to-digital converter chip with a working voltage support of 2.7V to 5.5V. It supports SPI, QSPI, Microwire, and DSP interfaces, and can be used to achieve digital signal control output analog voltage, restore analog signals, or provide controllable reference voltage. It has a wide range of applications in industrial field data acquisition, various instrument measurement equipment, and analysis equipment. RS1320 is based on mainstream market products and optimized for key parameters according to user application needs, further reducing linear error, zero code error temperature drift, gain error, and gain error temperature drift. It also optimizes and improves conversion rate while considering low power consumption, shortening output voltage establishment time to meet more application scenarios. Its main parameter characteristics are as follows: Ø Ensure output monotonicity; Built in buffer, rail to rail voltage output; Ø Power on output zero voltage; Low power consumption: 1.17mW (3.6V)/2.94mW (5.5V); Ø INL: - 0.7LSB/+1.2LSB； Ø DNL: - 0.1LSB/+0.2LSB； Ø Zero code error 1.3mV; Ø Full scale error -0.01% FS; Ø Output voltage establishment time 6 μ s @ CL=500pF Ø Supports SPI data interface; Ø Extended industrial temperature range:- 40 ° C~125 ° C.   RS1320 adopts a resistor string architecture design, achieving excellent AC/DC characteristics. Some parameter curves are referenced as follows: For more detailed data and parameter curves, please refer to the specification sheet.   RS1320 packaging and pin definition RS1320 provides standard SOT23-6 packaging, with pin definitions fully compatible with DAC121S101. Engineers from all walks of life are welcome to taste and evaluate.

Frequently Asked Questions

Question: How do you ensure the quality of the domestic chips you distribute?
Answer: We work with chip manufacturers that have strict quality control systems in place. All chips undergo multiple rounds of testing at the manufacturing stage, including electrical performance testing, reliability testing, and environmental testing. Before delivery, we also conduct sampling inspections to ensure that the products meet our quality standards. Additionally, we offer a quality guarantee period during which we will handle any quality-related issues promptly.
Question: What does the warranty policy for your domestic chips cover?
Answer: Our domestic chips come with a standard warranty period. During this time, if the chip fails due to manufacturing defects, we will provide free repair or replacement services. The warranty does not cover damages caused by improper use, unauthorized modifications, or external factors such as electrical surges or physical damage. To initiate a warranty claim, please contact our customer service team and provide detailed information about the problem and the chip's serial number.
Question: What kind of technical support can I get from you after purchasing your chips?
Answer: Our technical support team consists of experienced engineers who are proficient in chip technology. We offer pre-sales technical consultation to help you select the most suitable chips for your applications. After-sales, we provide assistance in chip integration, debugging, and performance optimization. You can reach out to our technical support hotline or email for any technical issues, and we will respond promptly.
Question: How can I be sure that your domestic chips are compatible with the existing systems and components in my project?
Answer: Our domestic chips are designed with broad compatibility in mind. Before you make a purchase, our technical team can offer in-depth consultations. We will analyze your specific system requirements, including interface types, power consumption, and operating frequencies, and then recommend the most suitable chips. Additionally, we have a library of technical documentation and case studies that showcase successful integrations with a wide range of systems and components, which can help you assess compatibility.
Question: How can I ensure a stable supply of your domestic chips, especially during peak demand periods?
Answer: We maintain close partnerships with multiple domestic chip manufacturers. Through long-term cooperation agreements and inventory management strategies, we strive to meet the demand of our customers. We also closely monitor market trends and adjust our procurement plans in advance to ensure a stable supply. In case of unexpected situations, we will promptly communicate with you and provide alternative solutions.

Latest know-How Articles

Blog Continental Group collaborates with Novesense to create safer automotive pressure sensor chips
Continental Group collaborates with Novesense to create safer automotive pressure sensor chips   On October 24, 2024, the 2024 Continental China Experience Day, hosted by Continental Group, was held in Gaoyou City, Jiangsu Province. Nearly 200 guests from the upstream and downstream of the automotive industry chain were invited to attend the conference and engage in in-depth dialogue on the collaborative development and future trends of the automotive industry, jointly exploring future market forms and opportunities. Wang Shengyang, founder, chairman, and CEO of Novosense, and Dr. Zhao Jia, director of Novosense Sensor Product Line, were invited to attend. During the event, Novosense and Continental Group announced a strategic partnership to jointly develop automotive pressure sensor chips.   In this collaboration, both parties will focus on jointly developing automotive grade pressure sensor chips with functional safety features. The newly developed pressure sensor chip will be based on Continental's next-generation global platform, with a focus on improving reliability and accuracy. It can be used to achieve safer and more reliable systems for automotive airbags, side collision monitoring, and battery pack collision monitoring.
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Blog ovosense micro car specification level 4/8-way half bridge drive NSD360x-Q1
Novosense micro car specification level 4/8-way half bridge drive NSD360x-Q1: multi load compatibility, enhancing the flexibility of automotive domain control systems     The Novosense NSD3604/8-Q1 series multi-channel half bridge gate driver chip covers 4/8 half bridge drivers and can drive at least 4 DC brushed motors, achieving multi-channel high current motor driving. It can also be used as a multi-channel high side switch driver. Very suitable for multi motor or multi load applications, such as car window lifting, electric seats, door locks, electric tailgates, and proportional valves for body control applications.     ◆ Wide operating voltage: 4.9V-37V (maximum 40V) ◆ 4, 8-channel half bridge gate drive ◆ Configurable timing charge discharge current drive (CCPD), optimized EMC performance ◆ Integrated 2-level charge pump for 100% PWM ◆ Integrated 2-channel programmable wide mode op amp <div style="position: relative;" data-slate-node="element" data-slate-fragment="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Blog National Technology Invited to Participate in 2024 Intel
Draw a blueprint together! National Technology Invited to Participate in 2024 Intel ®  LOEM Summit November 5-7, 2024, Intel 2024 ®  The LOEM Summit was grandly held in Bangkok, Thailand, and National Technology Co., Ltd. (hereinafter referred to as "National Technology"), as Intel's global partner, was invited to participate in the summit. This summit provides an important platform for 200 Intel business partners from around the world to enhance communication and connection, share development experiences, and actively explore new opportunities in the future. Taking this opportunity, National Technology showcased its fourth generation trusted computing chip NS350, high-precision metering battery management chip NB401, and related application cases at the summit, showcasing its product capabilities.   NS350 is the fourth generation trusted computing chip of National Technology, which has advantages such as high security, high performance, and great value. It is designed based on 40nm process, supports I2C and SPI interfaces, and provides packaging forms such as QFN32 and QFN16. It complies with China's TCM2.0 trusted password module standard (GM/T 0012-2020) and the international TPM2.0 (Spec 1.59) trusted computing standard. The chip has passed the CC security function testing and security assurance assessment by the international third-party authoritative testing agency THALES/CNES, and has obtained the CC EAL4+certification certificate issued by the French National Agency for Information Systems Security (ANSSI). The chip is compatible with international mainstream operating systems such as Windows, Linux, BSD UNIX, as well as domestic operating systems such as Galaxy Kirin, Tongxin, Fangde, and Shenzhou NetEase Government Edition Windows. It can be used in fields such as PC, server platforms, and embedded systems to protect information system security and effectively resist various attacks from the network. The national technology collaborative negative electrode material business develops electrochemical battery measurement algorithms, with core technological advantages supporting battery safety measurement and industry-leading high-precision SOC measurement algorithms. It provides AFE, MCU, BMS, and algorithm overall solutions for the consumer, industrial, and automotive electronics fields.   NB401 is a high-precision metering battery management chip launched by National Technology for the consumer market. The product integrates a high-precision power calculation method and has multiple functions such as battery monitoring, metering, protection, and certification. It can support the management and metering of 2-4 series of lithium-ion batteries or lithium polymer batteries. The chip integrates two 16 bit high-precision ADCs for voltage (or temperature) and current acquisition, as well as hardware protection and wake-up functions. It supports SMBus communication, intelligent charging management, and multiple safety certifications, with ultra-low power consumption characteristics, which can meet the needs of most battery management or metering applications in the consumer electronics field. It is suitable for battery pack applications in electronic devices such as laptops, tablets, mobile phones, cameras, drones, power tools, and power banks.
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