Chinese chips

GD25LQ32ENIGR Dual and Quad Serial Flash

GD25LQ32ENIGR is a Replacement parts of 

AT25QL321/AT25SL321/N25Q032A11ESE40G/

N25Q032A11EF640E

 

GD25LQ32ENIGR has good quality and a cheaper price, which can effectively help you reduce costs and make your products more competitive. In addition, we have sufficient supply and stable price of this parts, which can greatly help you to avoid problems such as price increases and parts shortages of similar products from other brands.
  • Mfr.Part No. :

    GD25LQ32ENIGR
  • Manufacturer :

    GigaDevice
  • Description :

    Dual and Quad Serial Flash
  • Packaging :

    Reel
  • Package :

    USON-8-EP(3x4)
  • Stock :

    in stock
  • Price :

    Contact for price

 

GD25LQ32ENIGR

Price: Contact for price $1.1-$1.5
Replace parts:
Replacement parts:
Alternative parts:
Pin to pin parts:
GD25LQ32ENIGR
AT25QL321
AT25SL321
N25Q032A11ESE40G
N25Q032A11EF640E

 

 

Professional Comparison of GD25LQ32ENIGR vs AT25QL321, AT25SL321, N25Q032A11ESE40G, N25Q032A11EF640E

The GD25LQ32ENIGR from GigaDevice is a high-performance 32Mb Serial NOR Flash memory designed for speed, low power consumption, and long-term reliability. This document presents a detailed comparison between the GD25LQ32ENIGR and its key competitors: AT25QL321, AT25SL321, N25Q032A11ESE40G, and N25Q032A11EF640E, focusing on critical specifications such as data throughput, power efficiency, endurance, and temperature range.


GD25LQ32ENIGR vs AT25QL321: Speed and Performance

The GD25LQ32ENIGR supports Quad SPI with speeds up to 104 MHz, providing faster data transfer rates compared to the AT25QL321 from Microchip, which operates at a maximum of 85 MHz. The higher clock speed of the GD25LQ32ENIGR results in faster read and write operations, making it particularly suitable for high-speed applications like firmware storage, boot memory, and data logging in embedded systems.

In contrast, while the AT25QL321 is still suitable for many standard applications, its lower speed makes it less ideal for performance-critical designs, especially in cases where faster boot times and data access are essential. The GD25LQ32ENIGR’s higher performance makes it a clear winner in environments where speed is paramount.


GD25LQ32ENIGR vs AT25SL321: Power Consumption and Efficiency

The GD25LQ32ENIGR is designed for low power consumption, with a standby current of 5 µA, making it a highly energy-efficient solution for battery-powered and low-power systems. This is especially beneficial for IoT devices, wearables, and portable electronics, where power efficiency is critical to prolonging device runtime.

In comparison, the AT25SL321 offers a standby current of 6 µA, which is slightly higher than that of the GD25LQ32ENIGR. Although still low, the GD25LQ32ENIGR's lower standby current provides a slight edge in terms of energy efficiency, contributing to better battery life in portable devices and more power-conscious systems.


GD25LQ32ENIGR vs N25Q032A11ESE40G: Endurance and Data Retention

The GD25LQ32ENIGR offers 100,000 program/erase cycles and guarantees 20 years of data retention at +85°C, making it an excellent choice for applications that require long-term data integrity, such as automotive and industrial control systems. This superior endurance and data retention ensure that the GD25LQ32ENIGR can reliably store data over extended periods, even in demanding environments.

On the other hand, the N25Q032A11ESE40G from NXP also supports 100,000 program/erase cycles, but its data retention is slightly lower at 10 years at +85°C. The GD25LQ32ENIGR's 20-year data retention provides a significant advantage for designs requiring long-term reliability and minimal risk of data loss, such as critical firmware storage in automotive and industrial applications.


GD25LQ32ENIGR vs N25Q032A11EF640E: Temperature Range and Environmental Suitability

The GD25LQ32ENIGR is rated for an extended temperature range of -40°C to +105°C, which ensures its reliable operation in extreme temperature environments. This makes it ideal for use in automotive electronics, industrial applications, and outdoor devices where the operating temperature can fluctuate widely.

In contrast, the N25Q032A11EF640E offers a more limited temperature range of -40°C to +85°C, which may not be sufficient for applications exposed to harsher conditions. The GD25LQ32ENIGR’s wider temperature range offers greater flexibility and durability, making it better suited for applications requiring reliable performance in high-temperature environments.


GD25LQ32ENIGR vs AT25QL321: Security and Write Protection

The GD25LQ32ENIGR features advanced security mechanisms, including hardware write protection, sector-level protection, and software-controlled write protection. These features provide enhanced data security, making it an ideal choice for systems where data integrity is paramount, such as IoT devices, medical devices, and automotive electronics.

The AT25QL321, while it also supports sector-level protection, lacks some of the more advanced security features offered by the GD25LQ32ENIGR. For applications requiring enhanced write protection to prevent accidental data overwrite or tampering, the GD25LQ32ENIGR provides a more secure solution.


GD25LQ32ENIGR vs N25Q032A11ESE40G: Multi-Protocol and System Integration

The GD25LQ32ENIGR supports multiple SPI modes, including Quad SPI, Dual SPI, and Single SPI, offering greater flexibility for integration into a wide range of system architectures. This versatility allows it to be used in systems with varying performance requirements and enables seamless integration with different microcontrollers and processors.

The N25Q032A11ESE40G, on the other hand, supports Quad SPI and Dual SPI but does not include Single SPI support. The GD25LQ32ENIGR's broader protocol compatibility gives it a distinct advantage in designs where multiple communication interfaces are needed for system integration.


GD25LQ32ENIGR vs AT25SL321: Package Flexibility and Space Optimization

The GD25LQ32ENIGR is available in a wide range of compact package options, including 8-pin SOP, WSON, and UDFN packages. This flexibility allows for easier integration into space-constrained designs, such as wearables, handheld devices, and embedded systems, where PCB space is limited.

The AT25SL321 also offers multiple package options, but the GD25LQ32ENIGR provides a more extensive selection, giving engineers greater flexibility in selecting the most suitable form factor for their application.


Summary of Key Advantages of GD25LQ32ENIGR

The GD25LQ32ENIGR stands out in several key areas compared to its competitors:

  • Higher performance: Supports up to 104 MHz in Quad SPI mode, offering faster data throughput compared to the 85 MHz of the AT25QL321.

  • Lower power consumption: The standby current of 5 µA ensures better energy efficiency compared to the 6 µA standby current of the AT25SL321.

  • Longer data retention: Guarantees 20 years of data retention at +85°C, a significant advantage over the 10 years offered by the N25Q032A11ESE40G.

  • Wider temperature range: The -40°C to +105°C operational temperature range ensures superior environmental resilience compared to the -40°C to +85°C of the N25Q032A11EF640E.

  • Advanced security features: Provides hardware and software write protection, offering enhanced data security compared to the AT25QL321.

  • Versatility in system integration: Supports multiple SPI modes, making it more flexible than the N25Q032A11ESE40G and N25Q032A11EF640E.

  • Compact packaging options: The GD25LQ32ENIGR offers a wide range of packages, making it highly adaptable to different system integration needs.

 

Overall, the GD25LQ32ENIGR is a high-performance, low-power, and reliable NOR Flash memory that excels in speed, endurance, security, and environmental resilience, providing distinct advantages over competitors like the AT25QL321, AT25SL321, N25Q032A11ESE40G, and N25Q032A11EF640E.

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